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It’s not just stress that produces instability

By admin on October 19th, 2009

In the Inventor Simulation Suite and Inventor Professional, the FEA solver can determine if a design will fail due to a high stress in the model, but this might only be half the story. If the model is in compression and is a thin or elongated structure, the model could fail due to its structural instability (Buckling) rather than deformation due to high stress. The Autodesk Algor solution includes critical buckling analysis to ensure this won’t be the primary mode of failure.

Thin walled plastic parts or sheet metal could be susceptible to buckling as well as traditional problems like truss or structural frame design.

While the structure below might have a high safety factor of 30 or more for the stress analysis, the buckling analysis shows only a multiplier of 27. This indicates that the structure could fail due to buckling rather than only exceeding the yield point of the material.

Contributed by Ben of the Tata Technologies CAD Geeks

By admin on October 19th, 2009
Topics: Autodesk Algor, Buckling, FEA
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Simulating Heat Transfer

By admin on October 12th, 2009

As some of you may have heard, Autodesk has recently acquired Algor FEA technology which further strengthens the simulation capabilities for its customers. One element of the Algor technology is the ability to simulate heat transfer scenarios for both steady state and transient(time based) problems.

Here is an example of a temperature applied to electrical contacts being dissipated over time to arrive at a steady state temperature. This can help us to determine questions like: Will my chip overheat? Do I need to include additional cooling fins?


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Check out this video of the temperature arriving at steady state: Watch video Here

Contributed by Ben of the CAD Geeks

By admin on October 12th, 2009
Topics: Autodesk Algor, FEA, Heat Transfer
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