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Simulating Heat Transfer

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As some of you may have heard, Autodesk has recently acquired Algor FEA technology which further strengthens the simulation capabilities for its customers. One element of the Algor technology is the ability to simulate heat transfer scenarios for both steady state and transient(time based) problems.

Here is an example of a temperature applied to electrical contacts being dissipated over time to arrive at a steady state temperature. This can help us to determine questions like: Will my chip overheat? Do I need to include additional cooling fins?


Check out this video of the temperature arriving at steady state: Watch video Here

Contributed by Ben of the CAD Geeks

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